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Wafer processing machine Product List

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[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors

[Case 2] Micromachining Technology for Backside Illuminated X-ray Image Sensors

Maximizing the opening rate with 1 million corner hole formations. Challenging the limits of semiconductor wafer processing.

The realization of high-sensitivity sensors requires extremely precise wafer processing technology to expand the light-receiving area. We conducted a special processing to form 1 million square holes with a 100µm pitch on a Φ200mm photodiode wafer. By maintaining square holes of 90µm and a thin wall structure of 10µm, we achieved an overwhelming large aperture ratio and successfully enhanced sensitivity. This is a fine processing solution unique to Connectec Japan, utilizing deep dry etching (DRIE) on silicon wafers. *The accuracy of wafer processing and detailed specifications are available in the downloadable materials.

  • Contract manufacturing
  • Wafer processing machine

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Commissioned Dicing STB Division

Commissioned Dicing STB Division

Grinding, CMP, dicing, pellet charging, appearance inspection! We offer a wide range of contract processing services.

We would like to introduce our CMP/Dicing business, "STB Division." We handle a wide range of dicing processes for brittle and hard materials such as glass with a film and ceramics, as well as backside grinding (BG) and polishing (CMP) of silicon wafers, dicing processes (bevel cut, step cut), and chip sorting after wafer processing. We serve as a pipeline between manufacturers that produce semiconductor wafers and those that assemble them. 【Features】 ■ Grinding Process: Back Grinding ■ CMP Process: Polishing ■ Dicing Process: Chip Processing ■ Pellet Charge Process: Chip Transfer Processing ■ Visual Inspection Process *For more details, please refer to the related links page or feel free to contact us.

  • Processing Contract
  • Wafer processing machine

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Hughes TechnoNet Wafer Services

Hughes TechnoNet Wafer Services

According to the customer's needs.

Through thorough quality control and excellent technology, we customize wafers to meet our customers' applications. We respond to requests with a full lineup of sizes.

  • Other polymer materials
  • Wafer processing machine

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